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HAD810-DDCO全自动平面固晶机
    发布时间: 2020-09-09 18:06    

HAD810-D1 (全自动平面固晶机)

(周期: 250ms

适用于IC类框架


一、机型特性

1.直线电机驱动的双点胶系统;

2.高精度直线驱动固晶邦头,音圈扭力环精确控制固晶压力;

3.高精度搜寻芯片平台,伺服电机驱动芯片角度矫正系统,配备自动扩膜系统;

4.采用点胶独立控制系统,胶量控制更加精确;

5.采用真空漏晶检测;

6.工控机控制设备运行,简化了自动化设备的使用方法;

7.精准的自动化设备为企业提高生产效率,降低成本提供了有效保障,从而切实有效地提高了企业竞争力;

HAD810-D1Fully Automatic Plenar Die Bonder

Cycle: 250ms

Suitable for IC leadframe

Modle Features

1.Linear motor-driven double dispensing system.

2.High precision linear driving die bond tieback,voice coil torsion loop accurately controls die bond pressure.

3.High-precision search chip platform, servo motor drive chip angle correction system, equipped with automatic film expansion system.

4.With separate dispensing control system, the glue quantity control is more precise.

5.Vacuum die missing testing technology is adopted.

6.IPC will control the operation of equipment,simplifying the usage of automation equipment.

7.Sophisticated equipment will help improve the enterprises production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprises competitiveness.

二、规格参数/Specifications and Parameters

1.系统功能/System Function

4、吸晶摆臂机械手系统/

Die Bonder’s Swing Arm-and-hand system

生产周期/Production Cycle

250ms(取决于芯片与支架)(Depending On Die Size And Holder)

直线旋转邦头

/Die Bonder

直线电机往复固晶,邦头旋转/linear motor reciprocate die bonding

固晶精度/Accuracy

±1mil(±0.025mm

吸晶压力

/Die Bond Pressure

可调30g—300g(Adjustable)

芯片旋转/Die Rotation

±3°

5.适用支架尺寸/Suitable Holder’s Size

2.芯片XY工作台/Die XY Workbench

支架长度/Length

110mm ~ 300mm

芯片尺寸/Die Dimensions

15mil×15mil-100mil×100mil
(0.38mm*0.38mm-2.54mm*2.54mm)

支架宽度/Width

25mm ~ 110mm

芯片最大角度修正/

Max. Angle Correction

±180°

6.所需设施/Facilities Needed

适用芯片环尺寸/

Max. Die Ring Size

外径(External Diameter):296mm   内径(Inner Diameter)254mm

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

最大芯片面积尺寸

/Max. Die Area

8(Expanded)

压缩空气/Compressed Air

0.5MPaMIN

分辨率/Resolution Ratio

0.04mil  (1μm)

额定功率/Rated Power

1820W

顶针Z高度行程/Thimble Z Height Stroke

120mil3mm

耗气量/Gas Consumption

40L/min

适用铁环/晶圆

Suitable Iron ring/ wafer

标配 10寸铁环8寸晶圆/Standard Equipped with 10Iron Ring and 8Wafer

可兼容 8寸铁环6寸晶圆/Compatible with 8Iron Ring and 6Wafer

3.图像识别系统/Image Recognition System

适用针筒规格

Suitable Barrel Spec.

标配10CC(可兼容5CC3CC) /Standard Equipped with 10CC, (Compatible with 5CCand 3CC)

灰阶度/Grey Scale

256级灰度(Level Grey)

7.体积及重量/Volume and Weight

分辨率/Resolution

656×492像素(Pixels)

xx/

Length x Width x Height

205×135×190cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

重量/Weight

1800kg

























































HAD810-D2
(全自动平面固晶机)

(周期: 250ms

适用于IC类框架


一、机型特性

1.直线电机驱动的双点胶系统;

2.高精度直线驱动固晶邦头,音圈扭力环精确控制固晶压力;

3.高精度搜寻芯片平台,伺服电机驱动芯片角度矫正系统,配备自动扩膜系统;

4.采用点胶独立控制系统,胶量控制更加精确;

5.采用真空漏晶检测;

6.工控机控制设备运行,简化了自动化设备的使用方法;

7.精准的自动化设备为企业提高生产效率,降低成本提供了有效保障,从而切实有效地提高了企业竞争力;


HAD810-D2
Fully Automatic Plenar Die Bonder

Cycle: 250ms

Suitable for IC leadframe

Modle Features

1.Linear motor-driven double dispensing system.

2.High precision linear driving die bond tieback,voice coil torsion loop accurately controls die bond pressure.

3.High-precision search chip platform, servo motor drive chip angle correction system, equipped with automatic film expansion system.

4.With separate dispensing control system, the glue quantity control is more precise.

5.Vacuum die missing testing technology is adopted.

6.IPC will control the operation of equipment,simplifying the usage of automation equipment.

7.Sophisticated equipment will help improve the enterprises production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprises competitiveness.


二、规格参数
/Specifications and Parameters

1.系统功能/System Function

4、吸晶摆臂机械手系统/

Die Bonder’s Swing Arm-and-hand system

生产周期/Production Cycle

250ms(取决于芯片与支架)(Depending On Die Size And Holder)

直线旋转邦头

/Die Bonder

直线电机往复固晶,邦头旋转/linear motor reciprocate die bonding

固晶精度/Accuracy

±1mil(±0.025mm

吸晶压力

/Die Bond Pressure

可调30g—300g(Adjustable)

芯片旋转/Die Rotation

±3°

5.适用支架尺寸/Suitable Holder’s Size

2.芯片XY工作台/Die XY Workbench

支架长度/Length

110mm ~ 300mm

芯片尺寸/Die Dimensions

15mil×15mil-100mil×100mil
(0.38mm*0.38mm-2.54mm*2.54mm)

支架宽度/Width

25mm ~ 110mm

芯片最大角度修正/

Max. Angle Correction

±180°

6.所需设施/Facilities Needed

适用芯片环尺寸/

Max. Die Ring Size

外径(External Diameter):296mm   内径(Inner Diameter)254mm

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

最大芯片面积尺寸

/Max. Die Area

8(Expanded)

压缩空气/Compressed Air

0.5MPaMIN

分辨率/Resolution Ratio

0.04mil  (1μm)

额定功率/Rated Power

1820W

顶针Z高度行程/Thimble Z Height Stroke

120mil3mm

耗气量/Gas Consumption

40L/min

适用铁环/晶圆

Suitable Iron ring/ wafer

标配 10寸铁环8寸晶圆/Standard Equipped with 10Iron Ring and 8Wafer

可兼容 8寸铁环6寸晶圆/Compatible with 8Iron Ring and 6Wafer

3.图像识别系统/Image Recognition System

适用针筒规格

Suitable Barrel Spec.

标配10CC(可兼容5CC3CC) /Standard Equipped with 10CC, (Compatible with 5CCand 3CC)

灰阶度/Grey Scale

256级灰度(Level Grey)

7.体积及重量/Volume and Weight

分辨率/Resolution

656×492像素(Pixels)

xx/

Length x Width x Height

205×135×190cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

重量/Weight

1800kg

























































HAD810-C
CLIP裁切贴装机)

(周期:185ms

适用于功率器件或IC芯片固定后的CLIP贴装工艺


一、机型特性

1Dispensing on DIE surface

采用独立五点胶结构,每组点胶XYZ独立运动,点胶互不干扰,结构紧凑,间距可调,数量可扩展,大大提高了点胶效率,每组点胶机构X/Y/Z向可调整方便调试维护

2clip attaching

高精密度冲切模具可保证切口毛刺小于0.05mm;刀具寿命可达1kk次;clipbond force参数化设定可保证芯片不受损

数据处理能力:

a,点胶点和Clip安装点位置/大小实时检测表格显示,位置/大小超出上下限报警停机

b,点胶点和Clip安装点位置/大小数据保存可追踪查询

c,点胶点和Clip安装点位置/大小数据统计功能,如cpk

d,点胶点和Clip安装点位置/大小数据检测结果生成mappingdie attaching使用


HAD810-C (Clip and Cutting Machine)

Cycle: 185ms

It is suitable for CLIP SMT technology after power device or IC chip is fixed

Product Features

1.Dispensing on DIE surface

Adopt independent five-point glue structure, each group dispensing glue XYZ moves independently, dispensing glue does not interfere with each other, compact structure, adjustable space, quantity can be expanded, greatly improve the efficiency of dispensing glue, each group dispensing glue X/Y/Z direction can be adjusted to facilitate debugging and maintenance.

2.Clip Attaching

The cutting burr is less than 0.05mm with the high-precision die-cutting mold; the tool life can reach to 1kk times; the clip bond force parameterization can protect the chip from damage.

Data processing capabilities:

a, Real time detection table display of the dispensing mark and clip mounting mark position/ size, auto-shutdown alarming system if position/size exceeds the upper or lower limits.

b, Dispensing mark and clip mounting mark position/ size data preservation for querying anytime.

c, Dispensing mark and clip mounting mark position/ size data statistics function, such as cpk.

d, Dispensing mark and clip mounting mark position/ size data detection results generate mapping for die attaching.


二、规格参数/Specifications and Parameters

1.系统功能/System Function

生产周期

Production Cycle

185ms(取决于芯片尺寸及支架和生产线综合效率)

(Depending on Die size and Holder)

2.送料工作平台/Loading Workbench

行程范围/Range of Stroke

100mmX300mm

3.适用支架尺寸/Suitable Holder’s Size

支架长度/Length

150 ~ 300mm

支架宽度/Width

50~ 100mm

4.所需设施/Facilities Needed

电压/频率

Voltage/Frequency

220V AC±5%/50HZ

压缩空气/Compressed Air

0.5MPaMIN

额定功率/Rated Power

1KW

耗气量/Gas Consumption

40L/min

5.体积及重量/Volume and Weight

xx

/Length*Width*Height

170×100×145cm

重量/Weight

1000kg

6.图像识别系统/Image Recognition Accuracy

图像识别/Image Recognition

256级灰度(Level Grey)

分辨率/Resolution

656×492像素(Pixels)

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)


一、HAD810-O(支架烘烤机)

适用于各种裸片式功率器件的焊接。

机型特性

1.产能 = 10~30 Sec. / 每一片(按锡膏商建议的Profile)

2.低耗电(升温时26KW/保温时2KW);低耗气(100/)

3.无氧化焊接 (氮气或氮氢混合气),含氧量20ppm以下

4.同一温区 温差小于5?C

5.可程序化之温度曲线设定

6.实时温度监控

7.不卡料之料片传送机构

优越性:

1. 炉体多温区设计,包含上料区(1个)+加热区(12个)+冷却区(2个),温度控制平滑,能够完美拟合锡膏的升温曲线.

2.可选配含氧量检测仪,实时监控炉内氧含量.

3.炉体半封闭设计,可极大减小氮气损耗,同时隔绝外部气流干扰.

4.氮气进气加热功能:氮气预热到设定温度再通入炉内,避免温区温度剧烈变化,影响炉内温度曲线

5.自动profile功能,系统可自动产生炉温曲线,并可保存查询

6.选用高品质加热管,保证同一温区各点实测最高温减最低温小于或等于5

7.炉体抽废管道具有加热功能,保证焊油不在管道内凝聚

8.油烟处理,新型水滤式油烟收集方式,回流焊接时产生之废气经处理后可直排大气。

9.炉内腔体清洁简单,保养周期 : 依锡膏品质/成份不同而异,如indium免清洗锡膏可一周清洁一次炉内腔体


HAD810-O (Reflow Oven)

Suitable for welding of all kinds of bare metal power devices.


Product Features

1. Capacity is 10~30 Sec. per piece (as recommended Profile by solder paste)

2.Low power consumption (26KW when warming up/2KW when keep warming); low gas consumption (100 liters/min)

3. No oxidation welding (nitrogen or nitrogen-hydrogen mixture), oxygen content below 20ppm

4. The temperature difference is less than 5?C in the same temperature zone

5. Programmable temperature curve setting

6. Instant temperature monitoring

7. Unloaded web transfer mechanism

Superiority

1.Multi-temperature zone design of furnace body, including feeding zone (1) + heating zone (12) + cooling zone (2), temperature control is smooth, which can perfectly fit the temperature rise curve of solder paste.

2.It can be equipped with an oxygen detector for real-time monitoring of oxygen content in the furnace.

3.Semi-closed furnace design can greatly reduce nitrogen loss and isolate external airflow interference.

4.Nitrogen inlet heating function: Nitrogen preheats to the set temperature and then passes into the furnace, avoiding the drastic change of temperature in the temperature zone and affecting the temperature curve in the furnace.

5.Automatic profile function, the system can automatically generate furnace temperature curve, and can save the query.

6.Select high-quality heating tubes to ensure that the measured maximum temperature minus minimum temperature at each point in the same temperature area is less than or equal to 5.

7.The furnace body drainage pipe has heating function to ensure that the welding oil does not condense in the pipe.

8.Lampblack treatment, a new type of water filter lampblack collection method, the waste gas generated during reflow welding can be directly discharged into the atmosphere after treatment.

9.The furnace cavity is easy to clean, and the maintenance cycle is different according to the solder paste quality/ingredients. For example, indium clean-free solder paste can clean the furnace cavity once a week.



二、规格参数:

Specifications and Parameters

1.系统功能/System Function

生产周期/Production Cycle

10~30 Sec. / 每一片(按锡膏商建议的Profile)

2.送料工作平台/Loading Workbench

行程范围/Range of Stroke

100mm*300mm

3.适用支架尺寸/Suitable Holder’s Size

支架长度/Length

150mm ~ 300mm

支架宽度/Width

50mm~ 100mm

4.所需设施/Facilities Needed

电压/频率/Voltage/Frequency

380V AC±5%/50HZ

压缩空气/Compressed Air

0.5MPaMIN

额定功率/Rated Power

32000W

耗气量/Gas Consumption

40L/min

5.体积及重量/Volume and Weight

xx/Length x Width x Height

210×120×150cm

重量/Weight

1200kg

6.温度/Temperature

范围/Range

0400

7.水流量及水温/Water Flow and Temperature

水流量/Water Flow

5L / Min

水温/Water Temperature

15~20?C

8.适用气体 Suitable Gas

N2 only

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