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GS128V直插式高速固晶机
    发布时间: 2019-06-29 16:14    

GS128V


直插式高速固晶机

(周期:145ms

适用于铁、铜垂直LED

一、机型特性

1.长短引线垂直式LED灯全自动固晶的最佳选择;

2.垂直式LED灯高速固晶(145ms/颗,每小时产量为22K)、精准的自动化设备为企业提高生产效率、降低成本提供了有效保障,从而切实有效地提高了企业竞争力;

3. 精准的固晶位置及优良的一致性为后道工序提供了先天的保障,同时固晶位置精准确保LED灯光斑的品质,良好焊接及漂亮光斑再加上优良晶片就构成了高品质LED产品;

4.采用直驱电机驱动邦头;

5.采用线性电机驱动晶片搜寻(X/Y)平台与送料B/C)平台;

6.采用可程式恒温点胶系统;

7.采用机械进料系统,避免气压不稳定造成进料不顺;

8.采用新式吸料机构,铜铁支架切换只需简单调节;

9.采用真空漏晶检测;

10.工控机控制设备运行,简化了自动化设备的操作。



GS128V

Direct Insert-type High-speed Die Bonder

Cycle: 145ms

It can be applied to iron and copper vertical LED products.  

Product Features

1.      It is the best choice for full-automation die bond of long and short lead vertical LED light;

2.      Vertical LED high-speed die bond (145ms/piece, 22K UPH) and sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

3.      Precise die bond location and excellent compatibility will guarantee the back-end processing; meanwhile, precise die bond location will also guarantee the high quality of LED lamp spot; thus, high-quality LED products will be created with excellent welding, elegant light spot and choiceness dies;

4.      Linear motor is applied to drive bond head;

5.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

6.      Programmed control constant-temperature adhesive dispensing system is also applied;

7.      Mechanical loading system is applied to avoid unsmooth loading caused by unstable air pressure;

8.      With the new suction mechanism, the switching of the copper-iron holder just need simple adjustment;

9.      Vacuum die missing testing technology is adopted;

10.  IPC will control the operation of equipment, simplifying the operation of automation equipment.


二、规格参数

Specifications and Parameters

 

1.系统功能/System Function

4.图像识别系统/Image Recognition System

生产周期/Production Cycle

145ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder)

灰阶度/Grey Scale

256级灰度Level Grey

芯片尺寸/Die Dimensions

5mil×5mil-80mil×80mil
(0.13mm*0.13mm-2mm*2mm)

分辨率/Resolution

512x512像素(Pixel)

通用垂直引线框架尺寸/General Vertical Lead Framework Dimensions

/L

150mm-230mm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

/T

19mm-40mm

(可根据特殊尺寸设计)

(Customizable)

5.系统精准度/ System Accuracy

XY位置精度/Accuracy

±1.5mil(±0.038mm

芯片旋转/Die Rotation

±3°

/H

0.3mm-0.6mm

6.焊头/Welding head

莭距/Pitch

4.5mm-15.5mm

吸晶摆臂/Swing Arm of Die Bonder

90°旋转焊臂(Rotatable Welding Arm)

最多可容纳物料/Materials Held at Most

4K-5K

吸晶压力/Die Bond Pressure

可调20g -250g(Adjustable)

2. 芯片处理器/Die Processor

7.所需设施/Facilities Needed

最大芯片环尺寸/Max. Die Ring Size

6.5(165mm)外径(External Diameter)

电压/频率Voltage/Frequency

220V AC ±5% / 50HZ

压缩空气/Compressed Air

0.5MPaMIN

最大芯片面积尺寸/Max. Die Area

4.7(119mm)扩张后(Expanded)

额定功率/Rated Power

700W

3.芯片工作台/Die XY Workbench

耗气量/Gas Consumption

5L/min

8.体积及重量/Volume and Weight

分辨率/Resolution Ratio

0.04mil(1μm)

xx/

Length x Width x Height

90x95x180cm

顶针Z高度行程/Thimble Z Height Stroke

80mil(2mm)

重量/Weight

515kg

 


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