It is compatible
with 2121、3014、2835 and 5050 etc.
Product Features
1.International leading double die bond, double adhesive dispense and double
die searching system;
2.Linear motor is applied to drive bond head;
3.Linear motor will drive the die to search corresponding platform(X/Y) and
corresponding loading platform (B/C);
4.Programmed control constant-temperature adhesive dispensing system is also
applied;
5.Vacuum die missing testing technology is adopted;
6.Stacking holders for loading (free-loading magazine) is applied to improve the production
efficiency largely;
7.IPC will control the operation of equipment, simplifying the operation of
automation equipment;
8.Sophisticated equipment will help improve your enterprise’s production
efficiency and reduce relevant costs so as to provide effective guarantee and
enhance the enterprise’s competitiveness;
9.Precise die bond location and excellent compatibility will guarantee the back-end
processing.