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GT100BH-PA
（週期：50ms）
適用於SMD020，1010，2121，2835，燈絲，COB等
一、機型特性
1.採用國際領先的雙固晶，雙點膠，雙晶片搜尋系統；
2.採用直驅電機驅動邦頭；
3.採用線性電機驅動搜尋晶片平臺（X/Y）與送料平臺（B/C）；
4.晶框採用自動角度修正系統；
5.採用可程式恒溫點膠系統；
6.採用真空漏晶檢測；
7.採用自動式上下料系統，減少換料時間；
8.採用自動裝卸晶環系統，有效提高了生產效率；
9.工控機控制設備運行，簡化了自動化設備的操作；
10.精准的自動化設備為企業提高生產效率，降低成本提供了有效保障，從而切實有效地提高了企業競爭力；
11. 精准的固晶位置及優良的一致性為後道工序提供了先天的保障。
GT100BH-PA
Plane-type High-speed Die Bonder
Cycle: 50ms
It is compatible with SMD020, 1010, 2121, 2835, lamp filament, and COB etc.
Product Features
1. International leading double die bond, double adhesive dispense and double die searching system;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
4. Crystal frame automatic correction chip structure is also applied;
5. Programmed control constant-temperature adhesive dispensing system is also applied;
6. Vacuum die missing testing technology is adopted;
7. Automatic loading and unloading system is applied to saving the time of reloading;
8. Automatic installing & uninstalling crystal rings is applied to improve the production efficiency largely;
9. IPC will control the operation of equipment, simplifying the operation of automation equipment;
10. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
11. Precise die bond location and excellent compatibility will guarantee the back-end processing.
二、規格參數
Specifications and Parameters
1.系統功能/System Function
4、吸晶擺臂機械手系統/
Die
Bonder’s Swing Arm-and-hand system
生產週期/Production Cycle
50ms
週期取決於晶片尺寸及支架(Depending On Die Size And Holder)
吸晶擺臂/Swing Arm of Die Bonder
90°可旋轉固晶(Rotatable Die Bond)
XY位置精度/Accuracy
±1mil(±0.025mm）
吸晶壓力/Die Bond Pressure
可調20g—250g(Adjustable)
晶片旋轉/Die Rotation
±1°
5.送料工作平臺/Loading
Workbench
2.晶片XY工作臺/Die XY
Workbench
行程範圍/Range of Stroke
170mm*75mm
晶片尺寸/Die Dimensions
3mil×3mil-80mil×80mil
XY解析度/XY Resolution
0.02mil(0.5μm)
6.適用支架尺寸/Suitable
Holder’s Size
晶片最大角度修正/Max. Angle Correction
±15°
支架長度/Length
120mm ~ 170mm（低於120-80需定制）(Need customize
if lower than 120-80mm)
最大晶片環尺寸/Max. Die Ring Size
6″（152mm）外徑(External
Diameter)
支架寬度/Width
40mm~ 75mm（低於40-30需定制）(Need customize
if lower than 40-30mm)
最大晶片面積尺寸/Max. Die Area
4.7″（119mm）擴張後(Expanded)
7.所需設施/Facilities
Needed
解析度/Resolution Ratio
0.04mil (1μm)
電壓/頻率/Voltage/Frequency
220V AC±5%/50HZ
壓縮空氣/Compressed Air
0.5MPa（MIN）
頂針Z高度行程/Thimble Z Height Stroke
80mil（2mm）
額定功率/Rated Power
950W
3.圖像識別系統/Image
Recognition System
耗氣量/Gas Consumption
5L/min
灰階度/Grey Scale
256級灰度(Level Grey)
8.體積及重量/Volume
and Weight
解析度/Resolution
656×492圖元(Pixels)
長x寬x高/Length x Width x Height
170×100×180cm
圖像識別精准度/Image Recognition Accuracy
±0.025mil@50mil觀測範圍(Observation
Range)
重量/Weight
1200kg
(0.076mm*0.076mm-2mm*2mm)
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