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GT836M
（週期：180ms）
適用於數碼、點陣、大功率、COB、SMD等
一、機型特性
1.平面式LED燈全自動固晶的最佳選擇；
2.高速固晶（180ms/顆，每小時產量為20K）、精准的自動化設備為企業提高生產效率、降低成本提供了有效保障，從而切實有效地提高了企業競爭力；
3. 精准的固晶位置及優良的一致性為後道工序提供了先天的保障；
4.採用直驅電機驅動邦頭；
5.採用全新接觸式探測系統控制擺臂，有效解決了PCB板或支架高度不一致而導致的固晶問題
6.採用線性電機驅動晶片搜尋平臺（X/Y）與固晶平臺（B/C）
7.採用可程式恒溫點膠系統；
8.採用真空漏晶檢測；
9. 工控機控制設備運行，簡化了自動化設備的操作；
GT836M
Plane-type High-speed Die Bonder
Cycle: 180ms
It is compatible with digital products, dot matrix, high power, COB, and SMD etc.
Product Features
1. It is the best choice for full-automation die bond of planar LED lights;
2. High-speed die bond(180ms/piece, 20K UPH) and sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
3. Precise die bond location and excellent compatibility will guarantee the back-end processing;
4. Linear motor is applied to drive bond head;
5. New touch-type deep detection system is applied to control the swing arm, solving the bonding issues caused by the non-uniform height of PCB or holder effectively;
6. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
7. Programmed control constant-temperature adhesive dispensing system is also applied;
8. Vacuum die missing testing technology is adopted;
9. IPC will control the operation of equipment, simplifying the operation of automation equipment.
二、規格參數
Specifications and Parameters
|
1.系統功能/System Function |
4、吸晶擺臂機械手系統/ Die Bonder’s Swing Arm-and-hand system |
||
|
生產週期/Production Cycle |
180ms（取決於晶片尺寸及支架）(Depending On Die Size And Holder) |
吸晶擺臂/Swing Arm of Die Bonder |
90°可旋轉固晶(Rotatable Die Bond) |
|
XY位置精度/Accuracy |
±1.5mil(±0.038mm） |
吸晶壓力/Die Bond Pressure |
可調20g—250g(Adjustable) |
|
晶片旋轉/Die Rotation |
±3° |
5.送料工作平臺/Loading Workbench |
|
|
2.晶片XY工作臺/Die XY Workbench |
行程範圍/Range of Stroke |
155mm*255mm |
|
|
晶片尺寸/Die Dimensions |
4mil×4mil-80mil×80mil |
XY解析度/XY Resolution |
0.02mil（0.5μm） |
|
最大晶片環尺寸/Max. Die Ring Size |
6″（152mm）外徑(External Diameter) |
6.所需設施/Facilities Needed |
|
|
最大晶片面積尺寸/Max. Die Area |
4.7″（119mm）擴張後(Expanded) |
電壓/頻率/Voltage/Frequency |
220V AC±5%/50HZ |
|
解析度/Resolution Ratio |
0.04mil (1μm) |
壓縮空氣/Compressed Air |
0.5MPa（MIN） |
|
頂針Z高度行程/Thimble Z Height Stroke |
80mil（2mm） |
額定功率/Rated Power |
700W |
|
3.圖像識別系統/Image Recognition System |
耗氣量/Gas Consumption |
5L/min |
|
|
灰階度/Grey Scale |
256級灰度(Level Grey) |
7.體積及重量/Volume and Weight |
|
|
解析度/Resolution |
512×512圖元(Pixels) |
長x寬x高/Length x Width x Height |
93×93×180cm |
|
圖像識別精准度/Image Recognition Accuracy |
±0.025mil@50mil觀測範圍(Observation Range) |
重量/Weight |
630kg |
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