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HAD308
（週期：80ms）
適用于普通貼片，COB, 二極體，三極管，倒裝支架等
一、機型特性
1.採用國際領先的雙固晶，雙點膠，雙晶片搜尋系統；
2.採用直驅電機驅動邦頭
3.採用線性電機驅動搜尋晶片平臺（X/Y）與送料平臺（B/C）
4. 晶框採用自動角度修正系統；
5.採用可程式恒溫點膠系統；
6.採用真空漏晶檢測；
7.採用免裝料盒上料方式，具備吸紙功能（能夠剔除框架隔離紙），有效提高了生產效率；
8.工控機控制設備運行，簡化了自動化設備的操作；
9.精准的自動化設備為企業提高生產效率，降低成本提供了有效保障，從而切實有效地提高了企業競爭力；
10. 精准的固晶位置及優良的一致性為後道工序提供了先天的保障
HAD308
Plane-type High-speed Die Bonder
Cycle: 80ms
It is compatible with SMD、COB 、diode、audion、flip-chip etc.
Product Features
1. International leading double die bond, double adhesive dispensing and double die searching system;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
4. Crystal frame automatic correction chip structure is also applied
5. Programmed control constant-temperature adhesive dispensing system is also applied;
6. Vacuum die missing testing technology is adopted;
7. Loading by free-loading magazine with paper suction function (eliminate the frame release paper), to largely improve the production efficiency;
8. IPC will control the operation of equipment, simplifying the operation of automation equipment;
9. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
10. Precise die bond location and excellent compatibility will guarantee the back-end processing.
二、規格參數
Specifications and Parameters
|
1.系統功能/System Function |
4、吸晶擺臂機械手系統/Die Bonder’s Swing Arm-and-hand system |
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|
生產週期/Production Cycle |
80ms（取決於晶片尺寸及支架）(Depending On Die Size And Holder) |
吸晶擺臂/Swing Arm of Die Bonder |
90°可旋轉固晶(Rotatable Die Bond) |
|
XY位置精度/Accuracy |
±1mil(±0.025mm） |
吸晶壓力/Die Bond Pressure |
可調20g—250g(Adjustable) |
|
晶片旋轉/Die Rotation |
±1° |
5.送料工作平臺/Loading Workbench |
|
|
2.晶片XY工作臺/Die XY Workbench |
行程範圍/Range of Stroke |
300mm*75mm |
|
|
晶片尺寸/Die Dimensions |
5mil×5mil-80mil×80mil |
XY解析度/XY Resolution |
0.02mil（0.5μm） |
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6.適用支架尺寸/Suitable Holder’s Size |
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晶片最大角度修正/Max. Angle Correction |
±15° |
支架長度/Length |
145mm ~ 300mm |
|
最大晶片環尺寸/Max. Die Ring Size |
8″（210mm）外徑 鐵環(External Diameter) Iron Ring |
支架寬度/Width |
40mm~ 75mm |
|
最大晶片面積尺寸/Max. Die Area |
6.5″（165mm）擴張後(Expanded) |
7.所需設施/Facilities Needed |
|
|
解析度/Resolution Ratio |
0.04mil (1μm) |
電壓/頻率/Voltage/Frequency |
220V AC±5%/50HZ |
|
頂針Z高度行程/Thimble Z Height Stroke |
80mil（2mm） |
壓縮空氣/Compressed Air |
0.5MPa（MIN） |
|
額定功率/Rated Power |
950W |
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3.圖像識別系統/Image Recognition System |
耗氣量/Gas Consumption |
5L/min |
|
|
灰階度/Grey Scale |
256級灰度(Level Grey) |
8.體積及重量/Volume and Weight |
|
|
解析度/Resolution |
656 x 492圖元(Pixels) |
長x寬x高/Length x Width x Height |
175 x125 x185cm |
|
圖像識別精准度/Image Recognition Accuracy |
±0.025mil@50mil觀測範圍(Observation Range) |
重量/Weight |
1470kg |
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