English
简体中文
繁體中文
HAD826PW-M（三頭平面式高速固晶機）
（單頭週期：300ms）
一、機型特性
1. 採用直驅電機驅動邦頭
2. 採用線性電機驅動搜尋晶片平臺（X/Y）與送料平臺（B/C）
3. 採用可程式恒溫雙點膠系統；
4. 採用真空漏晶檢測；
5. 採用自動式上下料，減少換料時間；
6. 工控機控制設備運行，簡化了自動化設備的操作；
7. 精准的設備化設備為企業提高生產效率，降低成本提供了有效保障，從而切實有效地提高了企業競爭力；
8. 精准的固晶位置及優良的一致性為後道工序提供了先天的保障，同時固晶位置精準確保LED燈光斑的品質，良好焊接及漂亮光斑再加上優良晶片就構成了高品質LED產品。
HAD826PW-M
Triple-head Plane-type High-speed Die Bonder
Single Head Cycle: 300ms
It is compatible with flip-chip PCB.
Product Features
1. Linear motor is applied to drive bond head;
2. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
3. Programmed control constant-temperature double adhesive dispensing system is also applied;
4. Vacuum die missing testing technology is adopted;
5. Automatic loading and unloading system is applied to saving the time of reloading;
6. IPC will control the operation of equipment, simplifying the operation of automation equipment;
7. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
8. Precise die bond location and excellent compatibility will guarantee the back-end processing; meanwhile, precise die bond location will also guarantee the high quality of LED lamp spot; thus, high-quality LED products will be created with excellent welding, elegant light spot and choiceness dies.
二、規格參數
Specifications and Parameters
|
1.系統功能/System Function |
4、吸晶擺臂機械手系統/ Die Bonder’s Swing Arm-and-hand system |
||
|
生產週期/Production Cycle |
300ms（取決於晶片尺寸及支架）(Depending On Die Size And Holder) |
吸晶擺臂/Swing Arm of Die Bonder |
130°可旋轉固晶(Rotatable Die Bond) |
|
XY精度/Accuracy |
±0.8mil(±0.02mm） |
吸晶壓力/Die Bond Pressure |
可調20g—250g(Adjustable) |
|
晶片旋轉/Die Rotation |
±3° |
5.送料工作平臺/Loading Workbench |
|
|
2.晶片XY工作臺/Die XY Workbench |
行程範圍/Range of Stroke |
260mm*200mm |
|
|
晶片尺寸/Die Dimensions |
3mil×3mil-80mil×80mil |
XY解析度/XY Resolution |
0.02mil（0.5μm） |
|
6.適用支架尺寸/Suitable Holder’s Size |
|||
|
晶片最大角度修正/Max. Angle Correction |
±30° |
支架長度/Length |
170-260mm |
|
最大晶片環尺寸/Max. Die Ring Size |
6″（152mm）外徑(External Diameter) |
支架寬度/Width |
80-200mm |
|
最大晶片面積尺寸/Max. Die Area |
4.7″（119mm）擴張後(Expanded) |
7.所需設施/Facilities Needed |
|
|
解析度/Resolution Ratio |
0.04mil (1μm) |
電壓/頻率/Voltage/Frequency |
220V AC±5%/50HZ |
|
頂針Z高度行程/Thimble Z Height Stroke |
80mil（2mm） |
壓縮空氣/Compressed Air |
0.5MPa（MIN） |
|
額定功率/Rated Power |
1819W |
||
|
3.圖像識別系統/Image Recognition System |
耗氣量/Gas Consumption |
5L/min |
|
|
灰階度/Grey Scale |
256級灰度(Level Grey) |
8.體積及重量/Volume and Weight |
|
|
解析度/Resolution |
656×492圖元(Pixels) |
長x寬x高/ Length x Width x Height |
332×125×210cm |
|
圖像識別精准度/Image Recognition Accuracy |
±0.025mil@50mil觀測範圍(Observation Range) |
重量/Weight |
2000kg |
首頁 | 公司介紹 | 產品服務 | 新聞資訊 | 聯系新萄京集团350vip們