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HAD129F
直插式高速固晶機
（週期：180ms）
適用於鐵、銅垂直LED
一、機型特性
1.長短引線垂直式LED燈全自動固晶的最佳選擇；
3.國內率先擁有高精度（雙PR）+高速度垂直式LED固晶設備；
4.採用直驅電機驅動邦頭；
5.採用線性電機驅動晶片搜尋(X/Y)平臺與送料B/C)平臺
6.採用可程式恒溫點膠系統；
7.採用機械進料系統，避免氣壓不穩定造成進料不順；
8.採用料盒進出料方式，保證引線框架不會相互碰撞，造成不必要的損壞；
9.採用真空漏晶檢測；
10.工控機控制設備運行，簡化了自動化設備的操作。
HAD129F
Direct Insert-type High-speed Die Bonder
Cycle: 180ms
It can be applied to iron and copper vertical LED products.
Product Features
1. It is the best choice for full-automation die bond of long and short lead vertical LED light;
2. Vertical LED high-speed die bond (180ms/piece, 20K UPH) and sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
3. High precision(double PR) and high speed vertical LED die bond is adopted;
4. Linear motor is applied to drive bond head;
5. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
6. Programmed control constant-temperature adhesive dispensing system is also applied;
7. Mechanical loading system is applied to avoid unsmooth loading caused by unstable air pressure;
8. The magazine loading and unloading way is applied to avoid the inter-collision of lead frame and can prevent unnecessary damage;
9. Vacuum die missing testing technology is adopted;
10. IPC will control the operation of equipment, simplifying the operation of automation equipment.
二、規格參數
Specifications and Parameters
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1.系統功能/System Function |
4.圖像識別系統/Image Recognition System |
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生產週期/Production Cycle |
180ms(取決於晶片尺寸及支架）(Depending On Die Size And Holder) |
灰階度/Grey Scale |
256級灰度（Level Grey） |
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晶片尺寸/Die Dimensions |
5mil×5mil-80mil×80mil |
解析度/Resolution |
512x512圖元(Pixel) |
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通用垂直引線框架尺寸/General Vertical Lead Framework Dimensions |
長/L |
145mm-160mm |
圖像識別精准度/Image Recognition Accuracy |
±0.025mil@50mil觀測範圍(Observation Range) |
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高/T |
20mm-40mm |
5.系統精准度/ System Accuracy |
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厚/H |
0.3mm-0.6mm |
XY位置精度/Accuracy |
±1.5mil(±0.038mm） |
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莭距/Pitch |
4.5mm-15.5mm |
晶片旋轉/Die Rotation |
±3° |
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最多可容納物料/Materials Held at Most |
2.5K |
6.焊頭/Welding head |
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2. 晶片處理器/Die Processor |
吸晶擺臂/Swing Arm of Die Bonder |
90°旋轉焊臂(Rotatable Welding Arm) |
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最大晶片環尺寸/Max. Die Ring Size |
8″(212mm)外徑(External Diameter) |
吸晶壓力/Die Bond Pressure |
可調20g -250g(Adjustable) |
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最大晶片面積尺寸/Max. Die Area |
6.5″(165mm)擴張後(Expanded) |
7.所需設施/Facilities Needed |
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最小晶片環尺寸/Min. Die Ring Size |
6″(152mm)外徑(External Diameter) |
電壓/頻率/Voltage/Frequency |
220V AC ±5% / 50HZ |
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壓縮空氣/Compressed Air |
0.5MPa（MIN） |
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3. 晶片工作臺/Die XY Workbench |
額定功率/Rated Power |
700W |
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解析度/Resolution Ratio |
0.04mil (1μm) |
耗氣量/Gas Consumption |
5L/min |
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頂針Z高度行程/Thimble Z Height Stroke |
80mil(2mm) |
8.體積及重量/Volume and Weight |
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長x寬x高/ Length x Width x Height |
130x80x230cm |
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重量/Weight |
850kg |
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