GT836M
Plane-type High-speed Die Bonder
Cycle: 180ms
It is compatible with digital products, dot matrix, high power, COB, and SMD etc.
Product Features
1. It is the best choice for full-automation die bond of planar LED lights;
2. High-speed die bond(180ms/piece, 20K UPH) and sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
3. Precise die bond location and excellent compatibility will guarantee the back-end processing;
4. Linear motor is applied to drive bond head;
5. New touch-type deep detection system is applied to control the swing arm, solving the bonding issues caused by the non-uniform height of PCB or holder effectively;
6. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
7. Programmed control constant-temperature adhesive dispensing system is also applied;
8. Vacuum die missing testing technology is adopted;
9. IPC will control the operation of equipment, simplifying the operation of automation equipment.
Specifications and Parameters
1.系统功能/System Function |
4、吸晶摆臂机械手系统/ Die Bonder’s Swing Arm-and-hand system |
||
生产周期/Production Cycle |
180ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder) |
吸晶摆臂/Swing Arm of Die Bonder |
90°可旋转固晶(Rotatable Die Bond) |
XY位置精度/Accuracy |
±1.5mil(±0.038mm) |
吸晶压力/Die Bond Pressure |
可调20g—250g(Adjustable) |
芯片旋转/Die Rotation |
±3° |
5.送料工作平台/Loading Workbench |
|
2.芯片XY工作台/Die XY Workbench |
行程范围/Range of Stroke |
155mm*255mm |
|
芯片尺寸/Die Dimensions |
4mil×4mil-80mil×80mil |
XY分辨率/XY Resolution |
0.02mil(0.5μm) |
最大芯片环尺寸/Max. Die Ring Size |
6″(152mm)外径(External Diameter) |
6.所需设施/Facilities Needed |
|
最大芯片面积尺寸/Max. Die Area |
4.7″(119mm)扩张后(Expanded) |
电压/频率/Voltage/Frequency |
220V AC±5%/50HZ |
分辨率/Resolution Ratio |
0.04mil (1μm) |
压缩空气/Compressed Air |
0.5MPa(MIN) |
顶针Z高度行程/Thimble Z Height Stroke |
80mil(2mm) |
额定功率/Rated Power |
700W |
3.图像识别系统/Image Recognition System |
耗气量/Gas Consumption |
5L/min |
|
灰阶度/Grey Scale |
256级灰度(Level Grey) |
7.体积及重量/Volume and Weight |
|
分辨率/Resolution |
512×512像素(Pixels) |
长x宽x高/Length x Width x Height |
93×93×180cm |
图像识别精准度/Image Recognition Accuracy |
±0.025mil@50mil观测范围(Observation Range) |
重量/Weight |
630kg |
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