It is compatible
with digital products, dot matrix, high power, COB, and SMD etc.
Product Features
1.It is the best choice for full-automation die bond of planar LED lights;
2.High-speed die bond(180ms/piece, 20K UPH) and sophisticated equipment will
help improve your enterprise’s production efficiency and reduce relevant costs
so as to provide effective guarantee and enhance the enterprise’s
competitiveness;
3.Precise die bond location and excellent compatibility will guarantee the
back-end processing;
4.Linear motor is applied to drive bond head;
5.New touch-type deep detection system is applied to control the swing arm,
solving the bonding issues caused by the non-uniform height of PCB or holder
effectively;
6.Linear motor will drive the die to search corresponding platform(X/Y) and
corresponding loading platform (B/C);
7.Programmed control constant-temperature adhesive dispensing system is also
applied;
8.Vacuum die missing testing technology is adopted;
9.IPC will control the operation of equipment, simplifying the operation of
automation equipment.
Specifications and Parameters
1.系统功能/System Function
4、吸晶摆臂机械手系统/
Die Bonder’s Swing Arm-and-hand system
生产周期/Production Cycle
180ms（取决于晶片尺寸及支架）(Depending On Die Size And Holder)
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