HAD826PW-M(三头平面式高速固晶机)
(单头周期:300ms)
一、机型特性
1. 采用直驱电机驱动邦头
2. 采用线性电机驱动搜寻晶片平台(X/Y)与送料平台(B/C)
3. 采用可程式恒温双点胶系统;
4. 采用真空漏晶检测;
5. 采用自动式上下料,减少换料时间;
6. 工控机控制设备运行,简化了自动化设备的操作;
7. 精准的设备化设备为企业提高生产效率,降低成本提供了有效保障,从而切实有效地提高了企业竞争力;
8. 精准的固晶位置及优良的一致性为后道工序提供了先天的保障,同时固晶位置精准确保LED灯光斑的品质,良好焊接及漂亮光斑再加上优良晶片就构成了高品质LED产品。
HAD826PW-M
Triple-head Plane-type High-speed Die Bonder
Single Head Cycle: 300ms
It is compatible with flip-chip PCB.
Product Features
1. Linear motor is applied to drive bond head;
2. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
3. Programmed control constant-temperature double adhesive dispensing system is also applied;
4. Vacuum die missing testing technology is adopted;
5. Automatic loading and unloading system is applied to saving the time of reloading;
6. IPC will control the operation of equipment, simplifying the operation of automation equipment;
7. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
8. Precise die bond location and excellent compatibility will guarantee the back-end processing; meanwhile, precise die bond location will also guarantee the high quality of LED lamp spot; thus, high-quality LED products will be created with excellent welding, elegant light spot and choiceness dies.
二、规格参数
Specifications and Parameters
1.系统功能/System Function |
4、吸晶摆臂机械手系统/ Die Bonder’s Swing Arm-and-hand system |
||
生产周期/Production Cycle |
300ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder) |
吸晶摆臂/Swing Arm of Die Bonder |
130°可旋转固晶(Rotatable Die Bond) |
XY精度/Accuracy |
±0.8mil(±0.02mm) |
吸晶压力/Die Bond Pressure |
可调20g—250g(Adjustable) |
芯片旋转/Die Rotation |
±3° |
5.送料工作平台/Loading Workbench |
|
2.芯片XY工作台/Die XY Workbench |
行程范围/Range of Stroke |
260mm*200mm |
|
芯片尺寸/Die Dimensions |
3mil×3mil-80mil×80mil |
XY分辨率/XY Resolution |
0.02mil(0.5μm) |
6.适用支架尺寸/Suitable Holder’s Size |
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晶片最大角度修正/Max. Angle Correction |
±30° |
支架长度/Length |
170-260mm |
最大芯片环尺寸/Max. Die Ring Size |
6″(152mm)外径(External Diameter) |
支架宽度/Width |
80-200mm |
最大芯片面积尺寸/Max. Die Area |
4.7″(119mm)扩张后(Expanded) |
7.所需设施/Facilities Needed |
|
分辨率/Resolution Ratio |
0.04mil (1μm) |
电压/频率/Voltage/Frequency |
220V AC±5%/50HZ |
顶针Z高度行程/Thimble Z Height
Stroke |
80mil(2mm) |
压缩空气/Compressed Air |
0.5MPa(MIN) |
额定功率/Rated Power |
1819W |
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3.图像识别系统/Image Recognition System |
耗气量/Gas Consumption |
5L/min |
|
灰阶度/Grey Scale |
256级灰度(Level Grey) |
8.体积及重量/Volume and Weight |
|
分辨率/Resolution |
656×492像素(Pixels) |
长x宽x高/ Length x Width x Height |
332×125×210cm |
图像识别精准度/Image Recognition Accuracy |
±0.025mil@50mil观测范围(Observation Range) |
重量/Weight |
2000kg |
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