HAD826PW-M（三头平面式高速固晶机）
（单头周期：300ms）
一、机型特性
1. 采用直驱电机驱动邦头
2. 采用线性电机驱动搜寻晶片平台（X/Y）与送料平台（B/C）
3. 采用可程式恒温双点胶系统；
4. 采用真空漏晶检测；
5. 采用自动式上下料，减少换料时间；
6. 工控机控制设备运行，简化了自动化设备的操作；
7. 精准的设备化设备为企业提高生产效率，降低成本提供了有效保障，从而切实有效地提高了企业竞争力；
8. 精准的固晶位置及优良的一致性为后道工序提供了先天的保障，同时固晶位置精准确保LED灯光斑的品质，良好焊接及漂亮光斑再加上优良晶片就构成了高品质LED产品。
HAD826PW-M
Triple-head Plane-type High-speed Die Bonder
Single Head Cycle: 300ms
It is compatible with flip-chip PCB.
Product Features
1. Linear motor is applied to drive bond head;
2. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
3. Programmed control constant-temperature double adhesive dispensing system is also applied;
4. Vacuum die missing testing technology is adopted;
5. Automatic loading and unloading system is applied to saving the time of reloading;
6. IPC will control the operation of equipment, simplifying the operation of automation equipment;
7. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
8. Precise die bond location and excellent compatibility will guarantee the back-end processing; meanwhile, precise die bond location will also guarantee the high quality of LED lamp spot; thus, high-quality LED products will be created with excellent welding, elegant light spot and choiceness dies.
二、规格参数
Specifications and Parameters
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1.系统功能/System Function |
4、吸晶摆臂机械手系统/ Die Bonder’s Swing Arm-and-hand system |
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生产周期/Production Cycle |
300ms（取决于晶片尺寸及支架）(Depending On Die Size And Holder) |
吸晶摆臂/Swing Arm of Die Bonder |
130°可旋转固晶(Rotatable Die Bond) |
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XY精度/Accuracy |
±0.8mil(±0.02mm） |
吸晶压力/Die Bond Pressure |
可调20g—250g(Adjustable) |
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芯片旋转/Die Rotation |
±3° |
5.送料工作平台/Loading Workbench |
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2.芯片XY工作台/Die XY Workbench |
行程范围/Range of Stroke |
260mm*200mm |
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芯片尺寸/Die Dimensions |
3mil×3mil-80mil×80mil |
XY分辨率/XY Resolution |
0.02mil（0.5μm） |
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6.适用支架尺寸/Suitable Holder’s Size |
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晶片最大角度修正/Max. Angle Correction |
±30° |
支架长度/Length |
170-260mm |
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最大芯片环尺寸/Max. Die Ring Size |
6″（152mm）外径(External Diameter) |
支架宽度/Width |
80-200mm |
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最大芯片面积尺寸/Max. Die Area |
4.7″（119mm）扩张后(Expanded) |
7.所需设施/Facilities Needed |
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分辨率/Resolution Ratio |
0.04mil (1μm) |
电压/频率/Voltage/Frequency |
220V AC±5%/50HZ |
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顶针Z高度行程/Thimble Z Height
Stroke |
80mil（2mm） |
压缩空气/Compressed Air |
0.5MPa（MIN） |
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额定功率/Rated Power |
1819W |
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3.图像识别系统/Image Recognition System |
耗气量/Gas Consumption |
5L/min |
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灰阶度/Grey Scale |
256级灰度(Level Grey) |
8.体积及重量/Volume and Weight |
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分辨率/Resolution |
656×492像素(Pixels) |
长x宽x高/ Length x Width x Height |
332×125×210cm |
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图像识别精准度/Image Recognition Accuracy |
±0.025mil@50mil观测范围(Observation Range) |
重量/Weight |
2000kg |
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