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HAD826PW-M
Triple-head Plane-type High-speed Die Bonder
Single Head Cycle: 300ms
It is compatible with flip-chip PCB.
Product Features
1. Linear motor is applied to drive bond head;
2. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
3. Programmed control constant-temperature double adhesive dispensing system is also applied;
4. Vacuum die missing testing technology is adopted;
5. Automatic loading and unloading system is applied to saving the time of reloading;
6. IPC will control the operation of equipment, simplifying the operation of automation equipment;
7. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
8. Precise die bond location and excellent compatibility will guarantee the back-end processing; meanwhile, precise die bond location will also guarantee the high quality of LED lamp spot; thus, high-quality LED products will be created with excellent welding, elegant light spot and choiceness dies.
Specifications
and Parameters
1.系统功能/System Function
4、吸晶摆臂机械手系统/
Die Bonder’s Swing Arm-and-hand system
生产周期/Production Cycle
300ms（取决于晶片尺寸及支架）(Depending On Die Size And Holder)
吸晶摆臂/Swing Arm of
Die Bonder
130°可旋转固晶(Rotatable Die Bond)
XY精度/Accuracy
±0.8mil(±0.02mm）
吸晶压力/Die Bond
Pressure
可调20g—250g(Adjustable)
芯片旋转/Die Rotation
±3°
5.送料工作平台/Loading Workbench
2.芯片XY工作台/Die XY Workbench
行程范围/Range of Stroke
260mm*200mm
芯片尺寸/Die Dimensions
3mil×3mil-80mil×80mil
XY分辨率/XY Resolution
0.02mil（0.5μm）
6.适用支架尺寸/Suitable Holder’s Size
晶片最大角度修正/Max. Angle Correction
±30°
支架长度/Length
170-260mm
最大芯片环尺寸/Max. Die Ring
Size
6″（152mm）外径(External Diameter)
支架宽度/Width
80-200mm
最大芯片面积尺寸/Max. Die Area
4.7″（119mm）扩张后(Expanded)
7.所需设施/Facilities Needed
分辨率/Resolution Ratio
0.04mil (1μm)
电压/频率/Voltage/Frequency
220V AC±5%/50HZ
顶针Z高度行程/Thimble Z Height
Stroke
80mil（2mm）
压缩空气/Compressed Air
0.5MPa（MIN）
额定功率/Rated Power
1819W
3.图像识别系统/Image Recognition System
耗气量/Gas Consumption
5L/min
灰阶度/Grey Scale
256级灰度(Level Grey)
8.体积及重量/Volume and Weight
分辨率/Resolution
656×492像素(Pixels)
长x宽x高/
Length x Width x Height
332×125×210cm
图像识别精准度/Image
Recognition Accuracy
±0.025mil@50mil观测范围(Observation Range)
重量/Weight
2000kg
(0.1mm*0.1mm-2mm*2mm)
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