HAD816-A(全自动高速固晶机)
(周期: 120ms)
适合于矩阵式沾胶工艺的IC支架,如DFN/QFN系列、SOP系列
一、机型特性
1.采用国际领先的单邦双臂固晶,可程式恒温双沾胶,晶片搜寻系统;
2.自主研发视觉系统&工控机控制系统,简化了自动化设备的操作,简单易操作&维护;
3.材料/产品的自动载入载出,叠料方式吸支架上料具备吸纸功能,料盒载出,有效提高了生产效率;
4.采用丝杆伺服驱动搜寻晶片平台(X/Y)与线性电机驱动送料平台(B/C);
5.采用晶框自动校正晶片结构以及自动扩蓝膜结构,兼容8寸和6寸晶圆;
6.单邦双臂固晶bondforce参数化调整,流量式芯片真空检漏晶测,稳定可靠;
7.可程式恒温双沾胶模组,效率大幅提升,胶点精度和一致性高;
8.固晶位置精准及优良的一致性,高品质产品的保证;
9.节拍:120毫秒/点,实际产出取决于芯片尺寸和支架上产品的密集度;
10.进收料采用外挂模式,可多台设备联机生产。
HAD816-A(Automatic High-speed Die
Bonder)
(Cycle: 120ms)
It is compatible with IC leadframe
of matrix viscose process, such as DFN/QFN series, SOP series.
1. International leading
single die bonder and double swing arms, with programmable constant temperature
double adhesive, and chip searching system.
2. Independently developed
visual system & industrial computer control system, simplifying the
operation of automatic equipment, easy to operate & maintain.
3. Automatic loading and
unloading of materials/products, the loading of stacking material suction
leadframe has the function of paper suction, and magazine unloading,
effectively improving the production efficiency.
4. Screw servo drive is
adopted to drive chip searching platform (X/Y) and linear motor is adopted to
drive feeding platform (B/C).
5. Automatic
frame-correcting wafer structure and automatic blue-expanding membrane
structure, compatible with 8-inch and 6-inch wafers.
6. Single die bonder and
double swing arms, bondforce parameter adjustment, flow-type chip vacuum
leaking detection crystal measurement, stable and reliable.
7. Programmable constant
temperature double adhesive module, greatly improving efficiency, glue point
accuracy and consistency.
8. Precise location and
good consistency of die bonding, guarantee of high quality.
9. Beat: 120 ms/point.
Actual output depends on chip size and the density of products on the
leadframe.
10. The material incoming
and receiving adopt plug-in mode, and multiple equipments can be operated
online.
Model Features
二、规格参数/Specifications and Parameters
1.系统功能/System Function |
4、吸晶摆臂机械手系统/Die Bonder’s Swing Arm-and-hand system |
||
生产周期 /Production Cycle |
120ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder) |
吸晶摆臂/Swing Arm of Die Bonder |
180°可旋转固晶(Rotatable Die Bond) |
XY位置精度/Accuracy |
±1mil(±0.025mm) |
吸晶压力 /Die Bond Pressure |
可调20g-250g (Adjustable) |
芯片旋转/Die Rotation |
±3° |
5.送料工作平台/Loading Workbench |
|
2.芯片XY工作台/Die XY Workbench |
行程范围 /Range of Stroke |
300mm*100mm |
|
芯片尺寸 /Die Dimensions |
5mil×5mil-90mil×90mil |
XY分辨率 /XY Resolution |
0.02mil(0.5μm) |
6.适用支架尺寸/Suitable Holder’s Size |
|||
晶片最大角度修正/Max. Angle Correction |
360° |
支架长度/Length |
150mm~ 300mm |
最大芯片环尺寸/Max. Die Ring Size |
10″(254mm)外径 铁环(External Diameter) Iron Ring |
支架宽度/Width |
50mm~ 100mm |
最大芯片面积尺寸/Max. Die Area |
8″(210mm)扩张后(Expanded) |
7.所需设施/Facilities Needed |
|
分辨率 /Resolution Ratio |
1μm |
电压/频率/Voltage/Frequency |
220V AC±5%/50HZ |
顶针Z高度行程 /Thimble Z Height Stroke |
160mil(4mm) |
压缩空气 /Compressed Air |
0.5MPa(MIN) |
额定功率/Rated Power |
930W |
||
3.图像识别系统/Image Recognition System |
耗气量 /Gas Consumption |
40L/min |
|
灰阶度/Grey Scale |
256级灰度(Level Grey) |
8.体积及重量/Volume and Weight |
|
分辨率/Resolution |
656X492像素(Pixels) |
长x宽x高/Length x Width x Height |
220X120X155(不含显示器)cm |
图像识别精准度/Image Recognition Accuracy |
±0.025mil@50mil观测范围 (Observation Range) |
重量/Weight |
1300kg |
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