HAD129F
直插式高速固晶机
（周期：180ms）
适用于铁、铜垂直LED
一、机型特性
1.长短引线垂直式LED灯全自动固晶的最佳选择；
2.垂直式LED灯高速固晶（180ms/颗，每小时产量为20K）、精准的自动化设备为企业提高生产效率、降低成本提供了有效保障，从而切实有效地提高了企业竞争力；
3.国内率先拥有高精度（双PR）+高速度垂直式LED固晶设备；
4.采用直驱电机驱动邦头；
5.采用线性电机驱动晶片搜寻(X/Y)平台与送料B/C)平台
6.采用可程式恒温点胶系统；
7.采用机械进料系统，避免气压不稳定造成进料不顺；
8.采用料盒进出料方式，保证引线框架不会相互碰撞，造成不必要的损坏；
9.采用真空漏晶检测；
10.工控机控制设备运行，简化了自动化设备的操作。
HAD129F
Direct Insert-type High-speed Die Bonder
Cycle: 180ms
It can be applied to iron and copper vertical LED products.
Product Features
1. It is the best choice for full-automation die bond of long and short lead vertical LED light;
2. Vertical LED high-speed die bond (180ms/piece, 20K UPH) and sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
3. High precision(double PR) and high speed vertical LED die bond is adopted;
4. Linear motor is applied to drive bond head;
5. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
6. Programmed control constant-temperature adhesive dispensing system is also applied;
7. Mechanical loading system is applied to avoid unsmooth loading caused by unstable air pressure;
8. The magazine loading and unloading way is applied to avoid the inter-collision of lead frame and can prevent unnecessary damage;
9. Vacuum die missing testing technology is adopted;
10. IPC will control the operation of equipment, simplifying the operation of automation equipment.
二、规格参数
Specifications and Parameters
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1.系统功能/System Function |
4.图像识别系统/Image Recognition System |
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生产周期/Production Cycle |
180ms(取决于晶片尺寸及支架）(Depending On Die Size And Holder) |
灰阶度/Grey Scale |
256级灰度（Level Grey） |
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芯片尺寸/Die Dimensions |
5mil×5mil-80mil×80mil |
分辨率/Resolution |
512x512像素(Pixel) |
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通用垂直引线框架尺寸/General Vertical Lead Framework Dimensions |
长/L |
145mm-160mm |
图像识别精准度/Image Recognition Accuracy |
±0.025mil@50mil观测范围(Observation Range) |
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高/T |
20mm-40mm |
5.系统精准度/ System Accuracy |
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厚/H |
0.3mm-0.6mm |
XY位置精度/Accuracy |
±1.5mil(±0.038mm） |
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莭距/Pitch |
4.5mm-15.5mm |
芯片旋转/Die Rotation |
±3° |
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最多可容纳物料/Materials Held at Most |
2.5K |
6.焊头/Welding head |
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2. 芯片处理器/Die Processor |
吸晶摆臂/Swing Arm of Die Bonder |
90°旋转焊臂(Rotatable Welding Arm) |
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最大芯片环尺寸/Max. Die Ring Size |
8″(212mm)外径(External Diameter) |
吸晶压力/Die Bond Pressure |
可调20g -250g(Adjustable) |
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最大芯片面积尺寸/Max. Die Area |
6.5″(165mm)扩张后(Expanded) |
7.所需设施/Facilities Needed |
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最小芯片环尺寸/Min. Die Ring Size |
6″(152mm)外径(External Diameter) |
电压/频率/Voltage/Frequency |
220V AC ±5% / 50HZ |
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压缩空气/Compressed Air |
0.5MPa（MIN） |
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3. 芯片工作台/Die XY Workbench |
额定功率/Rated Power |
700W |
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分辨率/Resolution Ratio |
0.04mil (1μm) |
耗气量/Gas Consumption |
5L/min |
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顶针Z高度行程/Thimble Z Height Stroke |
80mil(2mm) |
8.体积及重量/Volume and Weight |
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长x宽x高/ Length x Width x Height |
130x80x230cm |
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重量/Weight |
850kg |
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